Intel, a well-known tech company, has recently been chosen by the US military to make special types of chips called “chiplets”. But what are chiplets? They are tiny chips that can be assembled like building blocks to create a larger, more complex chip. This technology is gaining popularity because it allows for more flexibility and efficiency in chip design. As for why Intel was picked for this job, it’s likely due to their expertise and reputation in the chip-making industry. They have the knowledge and resources needed to produce these advanced chiplets for the US military.
Definition of Chiplets
Chiplets are like the building blocks of a semiconductor device. Each chiplet is a small piece of silicon that can be combined with other chiplets. Think of it like a puzzle, where each piece (chiplet) has a specific role and when you put them all together, you get a complete picture (a fully functional semiconductor device).
These chiplets can be arranged in different ways, even stacked on top of each other, and then they are placed on a single layer, which is then packaged.
Connecting these chiplets can be done in several ways, including using bond wires or directly bonding them using metallic connections.
When a device uses chiplets, its design is usually divided into major parts like the front end, processor, memory, and GPU.
Even though chiplets are becoming more popular, they are still not as common as the traditional designs which use a single piece of semiconductor. These traditional designs are called monolithic designs.
What is the reason for the rising popularity of chiplets?
The growing popularity of chiplets is a response to the challenges semiconductor manufacturers face due to the shrinking size of transistors. In the past, semiconductors used larger, micrometre-scale transistors, which were less susceptible to dust and defects, making them easier to mass-produce.
However, with today’s transistors now being smaller than 10nm, semiconductor factories need to maintain extremely clean environments (with as few as ten dust particles per cubic meter of air). This is because a single dust particle can damage a 10nm transistor and affect thousands of nearby transistors due to its size. Additionally, small transistors are more vulnerable to individual point defects in the semiconductor, which can lead to faulty transistors and a higher likelihood of chip failure.
To increase the yield of dies with small transistors, one approach is to reduce the overall size of the die. However, this leads to fewer transistors on each die. Increasing the physical size of each die allows for more transistors and more powerful circuits, but it also increases the cost per die due to a higher failure rate.
A solution that’s gaining traction is the use of chiplets, which are smaller functional dies that can use modern sub 10nm transistor features to perform complex functions. The final device integrates multiple chiplets into a single package, resulting in a powerful device with a high transistor count. This approach reduces the number of failed dies, thereby lowering the final cost of the die and maximizing yield.
What’s the reason behind the US military’s decision to select Intel as their semiconductor provider?
Intel recently secured a follow-up contract with the US military to aid in the development of cutting-edge military technology using sophisticated semiconductors. This project will be carried out in Intel’s factories in Oregon and Arizona, leveraging Intel’s chiplet technology. This technology not only offers a cost-effective approach when working with sub 10nm node technology, but it also enables the integration of dies from different manufacturers into a single custom package. This allows for highly specialized applications to maximize the use of semiconductor devices.
Intel hasn’t disclosed the financial details of the program, but the reasons for their selection by the US military are clear. At present, nearly 75% of the world’s semiconductor devices are produced in Asia. Given the recent tensions between China and the US, there’s a growing interest in shifting manufacturing back to the US. This is particularly important for the military, who want to ensure their products are made locally with a reliable supply chain. While many American companies can manufacture semiconductors, only three, including Intel, can fabricate high-end chiplet-based designs. The other two, TSMC and Samsung, are based in Asia.
In summary, Intel is an American company with local manufacturing facilities. Their ability to produce high-end processors using industry-leading packaging technology enables them to create some of the world’s most advanced semiconductors.
Readmore: