VPX Processing: GVPK40 – Kintex Ultrascale 3U

GVPK40®
  • XCKU115/KU085/KU060 Xilinx’s Kintex Ultrascale with A1517 (40mm x 40mm) package
  • 8GB DDR4 mapped to FPGA with 4 banks independent (2GB DDR4 per bank) and 2GB DDR4 mapped to Zynq
  • Upto 1,451K Logic cells, 663K LUTs & 5,520 DSP Slices
  • 3U VPX VITA46, VITA 65
  • Supported OpenVPX slot profiles
    • SLT3-PAY-2F1F2U-14.2.1
    • SLT3-PAY-1F2F2U-14.2.2
    • SLT3-PAY-2F2U-14.2.3
    • SLT3-PAY-1F1F2U-14.2.4
  • Industrial grade availability
  • 10+ Years Longevity

CONTACT SALE

3U Processing Board Features:

  • Dual FPGA architecture
    • Kintex Ultrascale
    • Zynq Ultrascale+ MPSoC
  • 8GB DDR4 mapped to FPGA
  • 2GB DDR4 mapped to Zynq
  • VITA 57.4 HSPC FMC+ site interfacing with the Ultrascale FPGA
  • Convection cooled
  • Up to two COM ports from the Zynq to the backplane
  • 1 GB Ethernet PHY to Backplane
  • Front Panel USB UART
  • SATA 3.0, Display Port to Backplane RTM
  • VPX Backplane GPIO
  • I2C Interface P0 to Zynq
  • Operating system support
    • Linux®
    • Windows®
    • VxWorks® (consult factory)
  • Full-featured Board Support Package (BSP)
    • Open VHDL reference design
    • Open C/C++
    • PCIe™ core included with BSP
  • Supported OpenVPX slot profiles
    • SLT3-PAY-2F1F2U-14.2.1
    • SLT3-PAY-1F2F2U-14.2.2
    • SLT3-PAY-2F2U-14.2.3
    • SLT3-PAY-1F1F2U-14.2.4
    • SLT3-PAY-1D-14.2.6
    • SLT3-PAY-2F-14.2.7
    • SLT3-PAY-1F4U-14.2.8
  • General Features:
Power Input 12V, 5V through VPX Connector
Form Factor 100mm x 60mm
Operating Temperature  -40°C to +85°C (Industrial)
Environment Specification RoHS & REACH Compliant
Compliance CE*

THERMAL SOLUTIONS

Thermal design is a significant factor for any highly integrated 3U VPX. GTEK supports Heat Sink and Fan Sink solution for Kintex Ultrascale 3U Processing VPX

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