SoM GTXZ31 – ZU7/ZU5/ZU4 Zynq UltraScale+

GTXZ31®
  • XCZU7/ZU5/ZU4 Xilinx’s Zynq Ultrascale+ MPSoC with FBVB900 (31mm x 31mm) package
  • Compatible with Zynq UltraScale+ CG/EG/EV devices
  • 64bit, 8GB PS DDR4 with ECC & 16bit, 4GB PL DDR4
  • Upto 504K Logic cells, 230K LUTs & 1,728 DSP Slices
  • Two 240pin High Speed Connectors with 142 user IOs
  • 16 Channels GTH Transceivers upto 16.3Gbps
  • 4 Channels GTR Transceivers upto 6Gbps
  • Industrial grade availability
  • 10+ Years Longevity

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On Module Feature:

  • XCZU7/ZY5/ZU4 – Zynq Ultrascale+ MPSoC – FBVB900 Package
    • Processing System (PS)
      • Quad/Dual Arm Cortex-A53 @1.5GHz, Dual Cortex-R5 @600MHz
      • H.264/H.265 Video Encoder/Decoder (VCU)
      • Arm Mali-400MP2 GPU @677MHz
    • Programming Logic (PL)
      • Up to 504K Logic cells, 230K LUTs & 1728 DSP Slices
      • PL GTH High Speed Transceivers x 16 @16.3 Gbps
  • 64bit, 4GB DDR4 RAM with ECC for PS (Upgradable up to 8GB)
  • 16bit, 2GB DDR4 RAM for PL (Upgradable up to 4GB)
  • 8GB eMMC Flash (Upgradable)
  • RGMII Ethernet PHY Transceiver
  • USB2.0 ULPI Transceiver

Board-to-Board Connectors Interfaces:

From PS Block

  • PS-GTR High-Speed Transceivers (up to 6Gbps) x 2
  • Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
  • RGMII Interface or ULPI Interface x 1
  • SD (4bit) x 1
  • SPI x 1
  • CAN x 2
  • Debug UART x 1
  • Data UART x 1
  • I2C x 2
  • PS JTAG

From PL Block

  • PL-GTH High-Speed Transceivers (up to 16.3Gbps) x 16
  • PL IOs – 156 IOs
    • HD Bank IOs – Up to 23 LVDS IOs/46 Single-ended (SE)
    • HP Bank IOs – Up to 48 LVDS IOs/96 Single-ended (SE)
    • GC Global Clock Input pins – Up to 15 LVDS/SE
    • ADC Input pins – Up to 16 Differential/Single Ended

OS Support:

  • Linux BSP – Petalinux/vivado 2020.1
  • Baremetal BSP – Vivado 2020.1

General Features:

Power Input 5V through B2B Connector
Form Factor 75mm x 95mm
Operating Temperature  -40°C to +85°C (Industrial)
Environment Specification RoHS & REACH Compliant
Compliance CE*

THERMAL SOLUTIONS

Thermal design is a significant factor for any highly integrated System On Modules. GTEK supports Heat Sink and Fan Sink solution for ZU7/ZY5/ZU4 Zynq UltraScale+ MPSoC SOM.

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DEVELOPMENT KIT

  • Gigabit Ethernet Jack x2
  • PCIe X1 & M.2 KEY B PCIe
  • M.2 KEY B SATA
  • USB 3.0 Type-A & Type-C
  • USB 2.0 Host Type-A x2
  • USB 2.0 OTG Type-micro AB x1
  • Standard SD x1
  • HDMI2.0/DP1.3 x1
  • MIPI DSI Connector
  • 20pin LVDS Connector
  • OV5640 MIPI CSI Camera Connector
  • Audio In/Out Jack through I2S Codec x2
  • MIPI CSI Camera Connector
  • Full Function UART – 1 Port
  • RTC with backup battery
  • CAN Header x2
  • Debug UART through Micro USB Port

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Documents

Design Support

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