SoM GTDZ40 – ZU48/ZU47/ZU43DR RF-SoC

GTXR40®
  •  Gen1 ZU25/ZU27/ZU28DR and Gen 3 ZU43/ZU47/ZU48DR Xilinx’s Zynq Ultrascale+ RFSoC with G1517 (40mm x 40mm) package
  • 64bit, 8GB PS DDR4 with ECC & 64bit, 8GB PL DDR4
  • Up to 930K Logic cells & 425K LUTs
  • Two 240pin High-Speed Connectors and One 160pin High Speed Connector for RF
  • 16 Channels GTH Transceivers up to 16.3Gbps
  • 4 Channels GTR Transceivers up to 6Gbps
  • Industrial grade availability
  • 10+ Years Longevity

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On Module Feature:

  • XCZU48/ZU47/ZU43DR (Gen3) – Zynq Ultrascale+ RFSoC – G1517 Package
    • Processing System (PS)
      • Quad/Dual Arm Cortex-A53 up to 1.3GHz, Dual Cortex-R5F MPCore up to 533 MHz
    • Programming Logic (PL)
      • 930K Logic cells, 425K LUTs & 4,272 DSP Slices
      • PL GTY High Speed Transceivers x 16 @16.3 Gbps
    • RF Data Converter
      • Up to 8 ADCs 14-bit with 5.0 Gsps
      • Up to 8 DACs 14-bit with 9.85 Gsps
      • Max Input Frequency to 6GHz
  • XCZU28/ZU27/ZU25DR (Gen1) – Zynq Ultrascale+ RFSoC – G1517 Package
    • Processing System (PS)
      • Quad/Dual Arm Cortex-A53 up to 1.3GHz, Dual Cortex-R5F MPCore up to 533 MHz
    • Programming Logic (PL)
      • 930K Logic cells, 425K LUTs & 4,272 DSP Slices
      • PL GTY High Speed Transceivers x 16 @16.3 Gbps
    • RF Data Converter
      • Up to 8 ADCs 12-bit with 4.096 Gsps
      • Up to 8 DACs 14-bit with 6.554 Gsps
      • Max Input Frequency to 4GHz
  • 64bit, 8GB DDR4 RAM with ECC for PS (Upgradable)
  • 64bit, 8GB DDR4 RAM without ECC for PL (Upgradable)
  • 32GB eMMC Flash (Upgradable)
  • RGMII Ethernet PHY Transceiver
  • USB2.0 ULPI Transceiver
  • Integrated Ultra low-noise programable RF PLL

Board-to-Board Connectors Interfaces:

From PS Block

  • PS-GTR High-Speed Transceivers (up to 6Gbps) x 4
  • Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
  • RGMII Interface or ULPI Interface x 1
  • SD (4bit) x 1
  • SPI x 1
  • CAN x 2
  • Debug UART x 1
  • Data UART x 1
  • I2C x 2
  • PS JTAG

From PL Block

  • PL-GTH High-Speed Transceivers (up to 16.3Gbps) x 16
  • PL IOs
    • HD Bank IOs – Up to 24 LVDS IOs/48 Single-ended (SE)
    • HP Bank IOs – Up to 64 LVDS IOs/128 Single-ended (SE)

From RF Block

  • Up to 8 ADC 12bits @ 4.096Gsps or 14bits @ 5.0Gsps
  • Up to 8 DAC 14bits @ 6.554Gsps or 14bits @ 9.85Gsps

OS Support:

  • Linux – Vivado

General Features:

Power Input 12V through B2B Connector
Form Factor 85mm x 95mm
Operating Temperature  -40°C to +85°C (Industrial)
Environment Specification RoHS & REACH Compliant
Compliance CE*

THERMAL SOLUTIONS

Thermal design is a significant factor for any highly integrated System On Modules. GTEK supports Heat Sink and Fan Sink solutions for XCZU19/ZU17/ZU11 Zynq UltraScale+ MPSoC SOM.

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DEVELOPMENT KIT

  • Gigabit Ethernet Jack x2
  • PCIe X1 & M.2 KEY B PCIe
  • M.2 KEY B SATA
  • USB 3.0 Type-A & Type-C
  • USB 2.0 Host Type-A x2
  • USB 2.0 OTG Type-micro AB x1
  • Standard SD x1
  • HDMI2.0/DP1.3 x1
  • MIPI DSI Connector
  • 20pin LVDS Connector
  • OV5640 MIPI CSI Camera Connector
  • Audio In/Out Jack through I2S Codec x2
  • MIPI CSI Camera Connector
  • Full Function UART – 1 Port
  • RTC with backup battery
  • CAN Header x2
  • Debug UART through Micro USB Port

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