SoM GTXZ23 – ZU5/ZU4/ZU3/ZU2/ZU1 Zynq UltraScale+

GTXC23®
  • XCZU5/ZU4/ZU3/ZU2/ZU1 Xilinx’s Zynq Ultrascale+ MPSoC with FBVC784 (23mm x 23mm) package
  • Compatible with Zynq UltraScale+ CG/EG/EV devices
  • 64bit, 2GB PS DDR4 with ECC & 16bit (up to 4GB), 1GB PL DDR4 (upto 2GB)
  • Upto 256K Logic cells, 117K LUTs & 1248 DSP Slices
  • Two 240pin High-Speed Connectors with 142 user IOs
  • 4 Channels GTH Transceivers up to 12.5Gbps
  • 4 Channels GTR Transceivers upto 6Gbps
  • Industrial grade availability
  • 10+ Years Longevity

CONTACT SALE

On Module Feature:

  • XCZU5/ZU4/ZU3/ZU2/ZU1 – Zynq Ultrascale+ MPSoC – C784 Package
    • Processing System (PS)
      • Quad/Dual Arm Cortex-A53 @1.5GHz, Dual Cortex-R5 @600MHz
      • H.264/H.265 Video Encoder/Decoder (VCU)
      • Arm Mali-400MP2 GPU @677MHz
    • Programming Logic (PL)
      • Up to 256K Logic cells, 117K LUTs & 1248 DSP Slices
      • PL GTH High Speed Transceivers x 04 @12.5 Gbps
  • 64bit, 2GB DDR4 RAM with ECC for PS (Upgradable up to 4GB)
  • 16bit, 1GB DDR4 RAM for PL (Upgradable up to 2GB)
  • 8GB eMMC Flash (Upgradable)
  • RGMII Ethernet PHY Transceiver
  • USB2.0 ULPI Transceiver

Board-to-Board Connectors Interfaces:

From PS Block

  • PS-GTR High-Speed Transceivers (up to 6Gbps) x 2
  • Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
  • RGMII Interface or ULPI Interface x 1
  • SD (4bit) x 1
  • SPI x 1
  • CAN x 2
  • Debug UART x 1
  • Data UART x 1
  • I2C x 2
  • PS JTAG

From PL Block

  • PL-GTH High-Speed Transceivers (up to 12.5Gbps) x 04
  • PL IOs – 156 IOs
    • HD Bank IOs – Up to 23 LVDS IOs/46 Single-ended (SE)
    • HP Bank IOs – Up to 48 LVDS IOs/96 Single-ended (SE)
    • GC Global Clock Input pins – Up to 15 LVDS/SE
    • ADC Input pins – Up to 16 Differential/Single Ended

OS Support:

  • Linux BSP – Petalinux/vivado 2020.1
  • Baremetal BSP – Vivado 2020.1

General Features:

Power Input 5V through B2B Connector
Form Factor 50mm x 60mm
Operating Temperature  -40°C to +85°C (Industrial)
Environment Specification RoHS & REACH Compliant
Compliance CE*

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for ZU7/5/4 Zynq UltraScale+ MPSoC SOM.

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DEVELOPMENT KIT

  • 10G Ethernet through SFP+ Connector
  • 3G/12G SDI Video IN through HD BNC Connector
  • 3G/12G SDI Video OUT through HD BNC Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP1.2a Display Port Connector
  • PCIe Gen2 x4 Connector
  • M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through MicroAB Connector
  • Standard SD Connector
  • CAN Header
  • Dual PMOD Connector
  • RTC Coin Cell Holder
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 130mm x 140mm

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Documents

Design Support

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